Intan Norshalina Sahrudin, Mohd Sharizal Abdul Aziz, Mohd. Zulkifly Abdullah, & Mohd Arif Anuar Mohd Salleh. (2024). Study on the Addition of Nanoparticles in the Lead-free Solder During Reflow Soldering via Numerical Simulation - A Review. CFD Letters, 12(5), 111–119. Retrieved from https://semarakilmu.com.my/journals/index.php/CFD_Letters/article/view/10016