Saliza Azlina Osman, Saikat Barua, Dayang Izzah Nabilah Awang Azman, Noor Izza Noor Hamdan and Iman Nur Sazniza Johari 2024. A Numerical Approach for Predicting Temperature Distribution, Heat Flow, and Material Deformation of Printed Circuit Board during Laser Soldering. Journal of Advanced Research in Applied Mechanics. 112, 1 (Jan. 2024), 46–56. DOI:https://doi.org/10.37934/aram.112.1.4656.