(1)
Saliza Azlina Osman; Saikat Barua; Dayang Izzah Nabilah Awang Azman; Noor Izza Noor Hamdan; Iman Nur Sazniza Johari. A Numerical Approach for Predicting Temperature Distribution, Heat Flow, and Material Deformation of Printed Circuit Board During Laser Soldering. J. Adv. Res. Appl. Mech. 2024, 112, 46-56.