(1)
Mun Kit, F. .; Abdul Haq, R. H.; Singh, Y.; Abdul Ghafir, M. F. .; Hassan, M. F. .; Abu Bakar, S. A. S. .; Hoffmann, J. . Optimization of Electroless Plating Solution Parameter for Coating PETG Electrode With Copper Using Design of Experiment (DOE). J. Adv. Res. Appl. Mech. 2024, 125, 1-13.