ZAHEER AHMED; MEFTAH HRAIRI; ZAKWAN YAZID. Numerical Evaluation of Adhesive Bonding Quality using Electromechanical Impedance Technique. Journal of Advanced Research in Applied Mechanics, [S. l.], v. 120, n. 1, p. 122–135, 2024. DOI: 10.37934/aram.120.1.122135. Disponível em: https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/5219. Acesso em: 22 nov. 2024.