SALIZA AZLINA OSMAN; SAIKAT BARUA; DAYANG IZZAH NABILAH AWANG AZMAN; NOOR IZZA NOOR HAMDAN; IMAN NUR SAZNIZA JOHARI. A Numerical Approach for Predicting Temperature Distribution, Heat Flow, and Material Deformation of Printed Circuit Board during Laser Soldering. Journal of Advanced Research in Applied Mechanics, [S. l.], v. 112, n. 1, p. 46–56, 2024. DOI: 10.37934/aram.112.1.4656. Disponível em: https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/3131. Acesso em: 20 may. 2024.