Saliza Azlina Osman, Saikat Barua, Dayang Izzah Nabilah Awang Azman, Noor Izza Noor Hamdan, and Iman Nur Sazniza Johari, “A Numerical Approach for Predicting Temperature Distribution, Heat Flow, and Material Deformation of Printed Circuit Board during Laser Soldering”, J. Adv. Res. Appl. Mech., vol. 112, no. 1, pp. 46–56, Jan. 2024.