Zaheer Ahmed, Meftah Hrairi, and Zakwan Yazid. “Numerical Evaluation of Adhesive Bonding Quality Using Electromechanical Impedance Technique”. Journal of Advanced Research in Applied Mechanics 120, no. 1 (June 30, 2024): 122–135. Accessed September 1, 2024. https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/5219.