Zaheer Ahmed, Meftah Hrairi, Zakwan Yazid. Numerical Evaluation of Adhesive Bonding Quality using Electromechanical Impedance Technique. J. Adv. Res. Appl. Mech. [Internet]. 2024 Jun. 30 [cited 2024 Nov. 22];120(1):122-35. Available from: https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/5219