KURHADE, A. S.; SIRASKAR, G. D.; BHAMBARE, P. S. .; KAITHARI, D. K. .; DIXIT, S. M. .; WAWARE, S. Y. . Enhancing Smartphone Circuit Cooling: A Computational Study of PCM Integration. Journal of Advanced Research in Numerical Heat Transfer, [S. l.], v. 27, n. 1, p. 132–145, 2024. DOI: 10.37934/arnht.27.1.132145. Disponível em: https://semarakilmu.com.my/journals/index.php/arnht/article/view/12372. Acesso em: 27 dec. 2024.