Law Ruen Ching and Mohd Zulkifly Abdullah 2022. A Review of Moldflow and Finite Element Analysis Simulation of Chip Scale Packaging (CSP) for Light Emitting Diode (LED). Journal of Advanced Research in Fluid Mechanics and Thermal Sciences. 99, 1 (Sep. 2022), 158–173. DOI:https://doi.org/10.37934/arfmts.99.1.158173.