Pang Shi Shiang, & Mohd Zulkifly Abdullah. (2024). Thermal Impact of Heat Spreader Co-Planarity to Electronic Packaging. Journal of Advanced Research in Fluid Mechanics and Thermal Sciences, 71(1), 1–9. Retrieved from https://semarakilmu.com.my/journals/index.php/fluid_mechanics_thermal_sciences/article/view/6229