FEI CHONG NG; LUN HAO TUNG; MOHAMAD AIZAT ABAS. Analytical Analysis on the Capillary Pressure of Underfill Flow Meniscus During the Flip-Chip Encapsulation Process. Journal of Advanced Research in Fluid Mechanics and Thermal Sciences, [S. l.], v. 94, n. 2, p. 174–183, 2022. DOI: 10.37934/arfmts.94.2.174183. Disponível em: https://semarakilmu.com.my/journals/index.php/fluid_mechanics_thermal_sciences/article/view/218. Acesso em: 22 nov. 2024.