PANG SHI SHIANG; MOHD ZULKIFLY ABDULLAH. Thermal Impact of Heat Spreader Co-Planarity to Electronic Packaging. Journal of Advanced Research in Fluid Mechanics and Thermal Sciences, [S. l.], v. 71, n. 1, p. 1–9, 2024. Disponível em: https://semarakilmu.com.my/journals/index.php/fluid_mechanics_thermal_sciences/article/view/6229. Acesso em: 22 jul. 2024.