NUR HASLINDA MOHAMED MUZNI; ERVINA EFZAN MHD NOOR; MOHD MUSTAFA AL-BAKRI ABDULLAH. Influence of TiO2 and Al2O3 Nanoparticles Addition on Thermal, Wettability and IMC Growth of Sn-3.0Ag-0.5Cu Lead-Free Solder at Different Reflow Temperature. Journal of Advanced Research in Fluid Mechanics and Thermal Sciences, [S. l.], v. 109, n. 1, p. 188–195, 2023. DOI: 10.37934/arfmts.109.1.188195. Disponível em: https://semarakilmu.com.my/journals/index.php/fluid_mechanics_thermal_sciences/article/view/2880. Acesso em: 19 may. 2024.