LAW RUEN CHING; MOHD ZULKIFLY ABDULLAH. A Review of Moldflow and Finite Element Analysis Simulation of Chip Scale Packaging (CSP) for Light Emitting Diode (LED). Journal of Advanced Research in Fluid Mechanics and Thermal Sciences, [S. l.], v. 99, n. 1, p. 158–173, 2022. DOI: 10.37934/arfmts.99.1.158173. Disponível em: https://semarakilmu.com.my/journals/index.php/fluid_mechanics_thermal_sciences/article/view/769. Acesso em: 5 may. 2024.