Pang Shi Shiang and Mohd Zulkifly Abdullah (2024) “Thermal Impact of Heat Spreader Co-Planarity to Electronic Packaging”, Journal of Advanced Research in Fluid Mechanics and Thermal Sciences, 71(1), pp. 1–9. Available at: https://semarakilmu.com.my/journals/index.php/fluid_mechanics_thermal_sciences/article/view/6229 (Accessed: 22 July 2024).