Nur Haslinda Mohamed Muzni, Ervina Efzan Mhd Noor, and Mohd Mustafa Al-Bakri Abdullah. “Influence of TiO2 and Al2O3 Nanoparticles Addition on Thermal, Wettability and IMC Growth of Sn-3.0Ag-0.5Cu Lead-Free Solder at Different Reflow Temperature”. Journal of Advanced Research in Fluid Mechanics and Thermal Sciences 109, no. 1 (October 30, 2023): 188–195. Accessed November 22, 2024. https://semarakilmu.com.my/journals/index.php/fluid_mechanics_thermal_sciences/article/view/2880.