Fei Chong Ng, Lun Hao Tung, and Mohamad Aizat Abas. “Analytical Analysis on the Capillary Pressure of Underfill Flow Meniscus During the Flip-Chip Encapsulation Process”. Journal of Advanced Research in Fluid Mechanics and Thermal Sciences 94, no. 2 (April 27, 2022): 174–183. Accessed March 29, 2024. https://semarakilmu.com.my/journals/index.php/fluid_mechanics_thermal_sciences/article/view/218.