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Nur Haslinda Mohamed Muzni, Ervina Efzan Mhd Noor, Mohd Mustafa Al-Bakri Abdullah. Influence of TiO2 and Al2O3 Nanoparticles Addition on Thermal, Wettability and IMC Growth of Sn-3.0Ag-0.5Cu Lead-Free Solder at Different Reflow Temperature. J. Adv. Res. Fluid Mech. Therm. Sc. [Internet]. 2023 Oct. 30 [cited 2024 Nov. 22];109(1):188-95. Available from: https://semarakilmu.com.my/journals/index.php/fluid_mechanics_thermal_sciences/article/view/2880