[1]
Ahmad, I.F., Omar, G., Kamat, S.R., Shamsuddin, S., Esa, S.R. and Setiawan, R. 2024. Interfacial Reaction and Intermetallic Compound Growth Behaviour of CNT-Filled Composite Solder on the Oxidizing Substrate. Journal of Advanced Research in Micro and Nano Engineering. 25, 1 (Nov. 2024), 95–106. DOI:https://doi.org/10.37934/armne.25.1.95106.