AHMAD, I. F.; OMAR, G.; KAMAT, S. R.; SHAMSUDDIN, S.; ESA, S. R.; SETIAWAN, R. Interfacial Reaction and Intermetallic Compound Growth Behaviour of CNT-Filled Composite Solder on the Oxidizing Substrate. Journal of Advanced Research in Micro and Nano Engineering, [S. l.], v. 25, n. 1, p. 95–106, 2024. DOI: 10.37934/armne.25.1.95106. Disponível em: https://semarakilmu.com.my/journals/index.php/micro_nano_engineering/article/view/11227. Acesso em: 5 dec. 2024.