N. . . Mohammad Noor, M. A. . Salim, N. A. . Masripan, C. . . Photong, . K. W. Chew, and A. Watson, “Stress Analysis on Hybrid Nanoparticle GNP/Ag for Flexible Semiconductor Packaging Devices”, J. Adv. Res. Micro Nano Eng., vol. 30, no. 1, pp. 22–32, Feb. 2025.