Mohammad Noor N, Salim MA, Masripan NA, Photong C, Chew KW, Watson A. Stress Analysis on Hybrid Nanoparticle GNP/Ag for Flexible Semiconductor Packaging Devices. J. Adv. Res. Micro Nano Eng. [Internet]. 2025 Feb. 28 [cited 2025 Apr. 1];30(1):22-3. Available from: https://semarakilmu.com.my/journals/index.php/micro_nano_engineering/article/view/13956