The Thermal Performance of Three-Layered Microchannel Heat Sink with Tapered Channel Profile

Jia-Wei Zuo; Kok-Cheong Wong; Hoon Kiat Ng

Authors

Jia-Wei Zuo Department of Mechanical, Materials and Manufacturing Engineering, University of Nottingham Malaysia Campus, Jalan Broga, Semenyih, Selangor, Malaysia
Kok-Cheong Wong Department of Mechanical, Materials and Manufacturing Engineering, University of Nottingham Malaysia Campus,Jalan Broga, Semenyih, Selangor, Malaysia
Hoon Kiat Ng Department of Mechanical, Materials and Manufacturing Engineering, University of Nottingham Malaysia Campus,Jalan Broga, Semenyih, Selangor, Malaysia

Keywords:

three layer , microchannel heat sink, parallel flow, counter flow, thermal performance

Abstract

The present study numerically investigated the thermal performance for three-layered microchannel heat sink (MCHS) with horizontally tapered channel profile. The problem is solved using a three-dimensional conjugate heat transfer model. Parallel flow andcounter flows configurations are investigated for their maximum thermal resistances. The effects of different tapered geometries of microchannel within the multi-layer MCHS are investigated by varying the channel inlet width and channel outlet width. The numerical results show that the three-layered MCHS with CF1 flow configuration givethe lowest value of thermal resistance for low value of channel inlet size (converging channel profile) while the parallelflow configuration shows lowest value of thermal resistance among all the flow configurations at high value of channel inlet size (converging channel profile). The results also show that counter flow configurations alterthe peak temperature location at the baseof heat sink along the flow direction toward the center of the channel, rendering better temperature uniformity.