About the Journal

 

The journal is concerned with high-level investigations of modern physical and mechanical problems and reports current progress in this field. The journal also encourages contributions from the newly emerging areas such as biomechanics, electromechanics, the mechanical behavior of advanced materials, nanomechanics, and many other inter-disciplinary research areas in which the concepts of applied mechanics are extensively applied and developed.

Most cited articles (Source: SCOPUS)

Effect of thermal insulation on building thermal comfort and energy consumption in Egypt, Morsy, M., Fahmy, M., Abd Elshakour, H., Belal, A.M.

Sustainable power generation pathways in Malaysia: Development of long-range scenarios, Samsudin, M.S.N., Rahman, M.M., Wahid, M.A.

A simulation on the effect of ultrasonic vibration on ultrasonic assisted soldering of Cu/SAC305/Cu joint, Sharaf, Hussein, Jalil, Nawal Aswan Abdul, Salman, Sadeq

Current Issue

Vol. 118 No. 1: June (2024)
					View Vol. 118 No. 1: June (2024)

EDITOR'S CHOICE

The Effect of Implant Length and Bone Quality on the Biomechanical Responses of Dental Implant and Surrounding Bone – A Three-Dimensional Finite Element Analysis
Muhammad Ikman Ishak, Ruslizam Daud, Siti Noor Fazliah Mohd Noor, Khor Chu Yee, Husniyati Roslan

 
Published: 2024-06-02

Articles

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Indexing
SCOPUS
CROSSREF
GOOGLE SCHOLAR
MY JURNAL

 

Publishing Frequency
Monthly
Publishing Model
Open access
Article Processing Charge (APC)
All articles published in this journal are open access and freely available online, free to download, share and re-use. To cover the cost of providing open access, Semarak Ilmu Publishing  charges an Article Processing Charge (APC) once an article is accepted for publication. There are no charges for rejected articles, no submission charges, and no surcharges based on the length of an article, tables, figures or supplementary data.

The APC charged for accepted articles;
USD500 (RM2500) (International Corresponding Author) or RM2000 (Malaysian Corresponding Author).