Effects of Sintering Atmosphere on The Optical, Thermal and Electrical Properties of Inkjet Printed ZnxCu(1-x)Fe2O4 Thin Films

Authors

  • Lim Joon Hoong School of Computer Science and Engineering, Taylor’s University Lakeside Campus, 47500 Subang Jaya, Malaysia

Keywords:

Thin film, Sintering atmosphere, Zinc copper ferrite, Thermoelectric properties

Abstract

The effects of sintering atmosphere on the optical, thermal, and electrical properties of inkjet-printed ZnxCu(1-x)Fe2O4 thin films have been investigated. The thin film samples were sintered separately in vacuum and oxygen. The obtained samples were then characterized by X-ray diffraction (XRD), optical band gap, electrical conductivity, Seebeck coefficient, and thermal conductivity. XRD analysis showed that the fabricated samples have a cubic spinel structure of zinc copper ferrite regardless of the sintering atmosphere. The electrical conductivity of ZnxCu(1-x)Fe2O4 thin films sintered in oxygen was about 5 % higher compared to ZnxCu(1-x)Fe2O4 thin films sintered in vacuum. The optical band gap shows that the samples sintered in oxygen had a smaller bandgap compared to samples sintered in vacuum. The electronic band structure simulated through ABINIT shows ZnxCu(1-x)Fe2O4 is an indirect band gap material. A smaller electronic bandgap was observed in O2 rich condition and was in agreement with the optical band gap and electrical conductivity test results. The Seebeck coefficient of ZnxCu(1-x)Fe2O4 thin films sintered in oxygen remained positive, confirming charge transport by hole carries as p-type semiconductors. A change from p-type to n-type semiconductors was observed when ZnxCu(1-x)Fe2O4 thin films sintered in vacuum.

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Published

2024-03-28

How to Cite

Lim Joon Hoong. (2024). Effects of Sintering Atmosphere on The Optical, Thermal and Electrical Properties of Inkjet Printed ZnxCu(1-x)Fe2O4 Thin Films. Journal of Advanced Research in Fluid Mechanics and Thermal Sciences, 81(2), 25–35. Retrieved from https://semarakilmu.com.my/journals/index.php/fluid_mechanics_thermal_sciences/article/view/7661

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