Numerical Study on Heat Transfer Performance Enhancement of Phase Change Material by Nanoparticles: A Review

Tung Hao Kean; Nor Azwadi Che Sidik; Yutaka Asako; Tan Lit Ken; Siti Rahmah Aid

Authors

Tung Hao Kean Malaysia –Japan International Institute of Technology (MJIIT), University Teknologi Malaysia Kuala Lumpur, Jalan Sultan Yahya Petra (Jalan Semarak), 54100 Kuala Lumpur, Malaysia
Nor Azwadi Che Sidik Malaysia –Japan International Institute of Technology (MJIIT), University Teknologi Malaysia Kuala Lumpur, Jalan Sultan Yahya Petra (Jalan Semarak), 54100 Kuala Lumpur, Malaysia
Yutaka Asako Malaysia –Japan International Institute of Technology (MJIIT), University Teknologi Malaysia Kuala Lumpur, Jalan Sultan Yahya Petra (Jalan Semarak), 54100 Kuala Lumpur, Malaysia
Tan Lit Ken Malaysia –Japan International Institute of Technology (MJIIT), University Teknologi Malaysia Kuala Lumpur, Jalan Sultan Yahya Petra (Jalan Semarak), 54100 Kuala Lumpur, Malaysia
Siti Rahmah Aid Malaysia –Japan International Institute of Technology (MJIIT), University Teknologi Malaysia Kuala Lumpur, Jalan Sultan Yahya Petra (Jalan Semarak), 54100 Kuala Lumpur, Malaysia

Keywords:

PMC, heat transfer, nanoparticles, nanofluid

Abstract

Phase change material (PCM) can be considered as an ideal solution for thermal management challenges. Owning to the large amount of heat energy can be stored or released during the phase change process, PCM widely applied for thermal energy storage (TES), cooling system and thermal comfort purpose. Nevertheless, PCM posting relative low thermal conductivity is the issues that affect its performance. Improvement in thermal performance of PCM are widely studied by former researchers. In this paper, a review on the recent study of heat transfer performance enhancement of PCM is presented. Based on the overview, dispersion of nanoparticles into PCM able to improve the heat transfer performance of PCM but there may also cause little drawback in Latent heat. Lastly, some assumptions and governing equation that applied in the numerical investigation are presented.