Effect of Peak Temperature on SAC Nano-Reinforced Fillet Height

Authors

  • Muhamed Abdul Fatah Muhamed Mukhtar Faculty of Engineering, DRB-HICOM University of Automotive Malaysia, 26607, Pekan, Pahang, Malaysia
  • Mohamad Aizat Abas School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, Nibong Tebal, 14300, Penang, Malaysia
  • Fakhrozi Che Ani Western Digital, MK13, Plot 301A Persiaran Cassia Selatan 1 Taman Perindustrian, Batu Kawan, 14100, Penang, Malaysia
  • Ahmad Amrul Muhaimin Azaman Faculty of Engineering, DRB-HICOM University of Automotive Malaysia, 26607, Pekan, Pahang, Malaysia

Keywords:

Nano-reinforced solder, SAC fillet height, nanoparticles distribution, discrete phase model, nanocomposite solder paste

Abstract

Recently, the addition of new materials into the conventional solder pastes provides a

viable solution to optimize the material characteristics and properties of the nano

particle filled solder paste. Addition of titanium oxide (TiO2) nanoparticles shown that

it can enable better performance of the solder. However, actual industry experiment

in terms of its optimum thermal profile for improved strength through good spread of

nano-particles in the solder is very costly and lengthy to set up. Hence, this paper

presents a preliminary study of the interaction between two models of numerical

simulation namely volume of fluid (VOF) and discrete phase model (DPM) then

compare with previous experimental data. This paper aims to analyse the effect of

peak temperature towards the fillet height of ultra-fine Sn-Ag-Cu (SAC) solder joints

doped with TiO2 nanoparticles in an electronic assembly. For the purpose of this

research, the weight percentage of the nanoparticles TiO2 with the SAC305 lead-free

reinforced solder is varied at different peak temperature and investigated in terms of

particles distribution, fillet height and thermal strain. This paper presents a 3D

numerical simulation of nano-reinforced lead (Pb)-free solder at the ultra-fine joint

component for 01005 capacitor with dimension of 0.2 x 0.2 x 0.4 mm³. The results

obtained are confirmed by conducting an experiment using a field emission scanning

electron microscope (SEM) joined with an EDS and X-ray diffraction machine. This

study concludes that the best fillet height would be obtained at 250°C. The

distributions of nanoparticles with 0.01 wt%, 0.05 wt%, and 0.15 wt% of weighted

percentage are effectively observed by using the HRTEM analysis. Based on the study,

higher temperature of the wetting region that range between 240°C and 255°C results

in better particle distributions, and fillet height of the solder by using temperature in

that range meets the requirement of IPC standards.

 

 

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Published

2024-10-14

Issue

Vol. 12 No. 9: September (2020)

Section

Articles

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