Thermal Performance Improvement of Microchannel Heat Sink for Electronic Device Cooling System Using Numerical Analysis
DOI:
https://doi.org/10.37934/arnht.26.1.8498Keywords:
Microchannel heat sink (MCHS), Thermal performance, Pin-fin configuration, CFD simulation, Heat transfer optimizationAbstract
The increasing miniaturization of technology has intensified thermal challenges, particularly concerning the cooling of small components like ICs and CPUs. Microchannel heat sinks offer a common solution, but optimizing their configurations remains a subject of interest. This study addresses multiple thermal enhancing factors that is position of the inlet and outlet and integrating pin-fin configurations. The objectives of the study are to improve the thermal uniformity of the heat sink and to analyse the thermal performance across the different geometry of pin-fin using Ansys. The thermal performance parameters focused on this study are the maximum temperature and pressure drop. The results gathered that hexagon shaped pin fin yield better thermal performance as compared to the other geometry as it shows the lowest maximum temperature, lowest thermal resistance and lowest pressure drop. This proves the significance of geometry selection for the pin fin as it affected the thermal performance of the microchannel heat sink with cross flow effects.
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