Enhancing Smartphone Circuit Cooling: A Computational Study of PCM Integration

Anant Sidhappa Kurhade; Gulab Dattrao Siraskar; Parimal Sharad  Bhambare; Dinesh Keloth  Kaithari; Swati Mukesh  Dixit; Shital Yashwant  Waware

doi:10.37934/arnht.27.1.132145

Authors

Anant Sidhappa Kurhade Department of Mechanical Engineering, Dr. D. Y. Patil Institute of Technology, Pimpri, Pune,411018, Maharashtra, India
Gulab Dattrao Siraskar Department of Mechanical Engineering, PCET’s Pimpri Chinchwad College of Engineering and Research, Ravet, Pune, 412101, Maharashtra, India
Parimal Sharad Bhambare Department of Mechanical and Industrial Engg., College of Engineering, National University of Science and Technology, Muscat, Oman
Dinesh Keloth Kaithari Department of Mechanical and Industrial Engineering, College of Engineering, National University of Science and Technology, Muscat, Oman
Swati Mukesh Dixit Department of Electronics and Telecommunication Engineering, Dr. D. Y. Patil Institute of Technology, Pimpri, Pune, 411018, Maharashtra, India
Shital Yashwant Waware Department of Mechanical Engineering, Dr. D. Y. Patil Institute of Technology, Pimpri, Pune,411018, Maharashtra, India

DOI:

https://doi.org/10.37934/arnht.27.1.132145

Keywords:

Active cooling, Passive Cooling, Smart-Phone, Phase Change Material

Abstract

Modern smartphones are used for a wide range of demanding tasks, such as gaming, high-resolution photography, and internet browsing, which significantly increases their power consumption. This excessive power use leads to higher heat generation within the device, typically between 2 and 6 watts. To manage this heat and maintain optimal performance, smartphones employ various cooling techniques. A new mobile cooling method could use innovative approaches like advanced phase change materials, liquid cooling systems, or emerging technologies such as thermoelectric and microfluidic cooling. This paper proposes a new cooling method using phase change materials. This approach leverages the material's ability to absorb heat by transitioning from a solid to a liquid state and vicecersa. This helps keep the device's temperature below 45 degrees Celsius. In mid-range smartphones, cooling methods such as natural convection, indirect heat-pipe cooling, and forced convection are commonly used, but these methods often fail under high-power usage conditions.

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Author Biographies

Anant Sidhappa Kurhade, Department of Mechanical Engineering, Dr. D. Y. Patil Institute of Technology, Pimpri, Pune,411018, Maharashtra, India

a.kurhade@gmail.com

Gulab Dattrao Siraskar, Department of Mechanical Engineering, PCET’s Pimpri Chinchwad College of Engineering and Research, Ravet, Pune, 412101, Maharashtra, India

gdsiraskar@gmail.com

Parimal Sharad Bhambare, Department of Mechanical and Industrial Engg., College of Engineering, National University of Science and Technology, Muscat, Oman

parimalbhambare@nu.edu.om

Shital Yashwant Waware, Department of Mechanical Engineering, Dr. D. Y. Patil Institute of Technology, Pimpri, Pune,411018, Maharashtra, India

sheetal.wawre@dypvp.edu.in

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