Numerical Simulation of Laser Soldering Process on Pin Through Hole (PTH)

Authors

  • Saifulmajdy A. Zahiri School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, Nibong Tebal, 14300, Penang, Malaysia
  • Mohamad Aizat Abas School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, Nibong Tebal, 14300, Penang, Malaysia
  • Fei Chong Ng School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, Nibong Tebal, 14300, Penang, Malaysia
  • Mohamad Fikri Mohd Sharif Western Digital, MK13, Plot 301A Persiaran Cassia Selatan 1 Taman Perindustrian, Batu Kawan, 14100, Penang, Malaysia
  • Fakhrozi Che Ani Western Digital, MK13, Plot 301A Persiaran Cassia Selatan 1 Taman Perindustrian, Batu Kawan, 14100, Penang, Malaysia

DOI:

https://doi.org/10.37934/arfmts.98.1.137145

Keywords:

Computational Fluid Dynamics (CFD), laser soldering, Pin Through Hole (PTH), Finite Volume Method (FVM), lead-free solder, SAC 305

Abstract

The increasing demands in the miniaturization of microelectronic products promotes the automation of electronic assembly and manufacturing process such as laser soldering to deliver high quality and flexibility of solder joints. This paper investigates possibility of using computational fluid dynamics (CFD) to create simulation of laser soldering process. Heating process of solder phase was simulated Using finite volume method (FVM) and energy equation enabled. Results of the simulation was compared with experiment for validation. Generally, it is found that the solder formation is identical for both simulation and experimental process. Moreover, the temperature distribution shows that heating process of laser soldering has great heating distribution along the solder region.

Author Biographies

Saifulmajdy A. Zahiri, School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, Nibong Tebal, 14300, Penang, Malaysia

saifulmajdy@student.usm.my

Mohamad Aizat Abas, School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, Nibong Tebal, 14300, Penang, Malaysia

aizatabas@usm.my

Fei Chong Ng, School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, Nibong Tebal, 14300, Penang, Malaysia

feichong@usm.my

Mohamad Fikri Mohd Sharif, Western Digital, MK13, Plot 301A Persiaran Cassia Selatan 1 Taman Perindustrian, Batu Kawan, 14100, Penang, Malaysia

mohamad.fikri.mohd.sharif@wdc.com

Fakhrozi Che Ani, Western Digital, MK13, Plot 301A Persiaran Cassia Selatan 1 Taman Perindustrian, Batu Kawan, 14100, Penang, Malaysia

fakhrozi.che.ani@wdc.com

Downloads

Published

2022-07-30

How to Cite

Saifulmajdy A. Zahiri, Mohamad Aizat Abas, Fei Chong Ng, Mohamad Fikri Mohd Sharif, & Fakhrozi Che Ani. (2022). Numerical Simulation of Laser Soldering Process on Pin Through Hole (PTH). Journal of Advanced Research in Fluid Mechanics and Thermal Sciences, 98(1), 137–145. https://doi.org/10.37934/arfmts.98.1.137145

Issue

Vol. 98 No. 1: October (2022)

Section

Articles