Development and Characterization of Electrical Discharge Coating Electrode Through Powder Metallurgy Process

Authors

  • Jun Hong Chong Fakulti Teknologi dan Kejuruteraan Industri dan Pembuatan, Universiti Teknikal Malaysia Melaka, Hang Tuah Jaya, 76100 Durian Tunggal, Melaka, Malaysia
  • Pay Jun Liew Fakulti Teknologi dan Kejuruteraan Industri dan Pembuatan, Universiti Teknikal Malaysia Melaka, Hang Tuah Jaya, 76100 Durian Tunggal, Melaka, Malaysia
  • Sivarao Subramonian Fakulti Teknologi dan Kejuruteraan Industri dan Pembuatan, Universiti Teknikal Malaysia Melaka, Hang Tuah Jaya, 76100 Durian Tunggal, Melaka, Malaysia
  • Abreeza Manap Department of Mechanical Engineering, College of Engineering, Universiti Tenaga Nasional, Jalan IKRAM-UNITEN, 43000, Kajang, Selangor, Malaysia
  • T. Joseph Sahaya Anand School of Computing, MIT Vishwaprayag University, Solapur, 413255, India

DOI:

https://doi.org/10.37934/armne.29.1.104113

Keywords:

Electrical discharge coating (EDC), powder metallurgy (PM), copper electrode, density, porosity, microstructure

Abstract

In this study, copper electrodes for electrical discharge coating (EDC) application were fabricated by using the powder metallurgy (PM) process. The effect of different compaction loads (ranging from 3 to 5 tons) and sintering temperatures (ranging from 450 to 650°C) on the mechanical properties of the PM electrodes, specifically on porosity, density, and microstructure were investigated. The copper powder was mixed with stearic acid by using a planetary ball mill, followed by compaction and sintering operations. The results showed that the PM copper electrodes exhibited higher density and less porosity with the increase in compaction load and sintering temperature. The PM copper electrode with the highest density and lowest porosity was obtained by using 5 tons of compaction load and 650 °C sintering temperature. Furthermore, the microstructures showed a dense network with minimal pores and smaller pore sizes, indicating excellent particle compaction and interconnectivity resulting from the combined effects of high compaction pressure and high sintering temperature.

Downloads

Author Biographies

Jun Hong Chong, Fakulti Teknologi dan Kejuruteraan Industri dan Pembuatan, Universiti Teknikal Malaysia Melaka, Hang Tuah Jaya, 76100 Durian Tunggal, Melaka, Malaysia

payjun81@gmail.com

Pay Jun Liew, Fakulti Teknologi dan Kejuruteraan Industri dan Pembuatan, Universiti Teknikal Malaysia Melaka, Hang Tuah Jaya, 76100 Durian Tunggal, Melaka, Malaysia

payjun@utem.edu.my

Sivarao Subramonian, Fakulti Teknologi dan Kejuruteraan Industri dan Pembuatan, Universiti Teknikal Malaysia Melaka, Hang Tuah Jaya, 76100 Durian Tunggal, Melaka, Malaysia

sivarao@utem.edu.my

Abreeza Manap, Department of Mechanical Engineering, College of Engineering, Universiti Tenaga Nasional, Jalan IKRAM-UNITEN, 43000, Kajang, Selangor, Malaysia

Abreeza@uniten.edu.my

T. Joseph Sahaya Anand, School of Computing, MIT Vishwaprayag University, Solapur, 413255, India

Joseph.Anand@mitvpu.ac.in

Downloads

Published

2025-01-31

How to Cite

Chong, J. H. ., Liew, P. J. ., Subramonian, S. ., Manap, A. ., & Anand, T. J. S. . (2025). Development and Characterization of Electrical Discharge Coating Electrode Through Powder Metallurgy Process. Journal of Advanced Research in Micro and Nano Engineering, 29(1), 104–113. https://doi.org/10.37934/armne.29.1.104113

Issue

Section

Articles

Similar Articles

1 2 3 4 > >> 

You may also start an advanced similarity search for this article.