Extrinsic Activation Energy for Enhanced Solid-State Metallic Diffusion for Electrical Conductive Ink

Authors

  • Intan Fatihah Ahmad faculty of Mechanical Engineering Universiti Teknikal Malaysia Melaka, Hang TuahJaya, 76100 Durian Tunggal, Melaka, Malaysia
  • Ghazali Omar Faculty of Mechanical Engineering Universiti Teknikal Malaysia Melaka, Hang TuahJaya, 76100 Durian Tunggal, Melaka, Malaysia
  • Mohd Azli Salim Faculty of Mechanical Engineering Universiti Teknikal Malaysia Melaka, Hang TuahJaya, 76100 Durian Tunggal, Melaka, Malaysia

Keywords:

Electrons, solid-state, diffusion mechanism

Abstract

In the new area of Advanced Manufacturing Technology, Stretchable Conductive Ink (SCI) has become a future electronic circuit with some unique properties. The Printed Circuit Board (PCB) and other electronic rigid sheet substrate will be shifting into flexible thin layers. SCI will act as interconnect for electronic components. However, the information about diffusion mechanism in SCI is still limited at this time. Therefore, the purpose of this paper is to disseminate information on the role of diffusion mechanism enhance the conductivity in SCI. In addition, this paper introduces the relationship between diffusion mechanism and electron mobilization. Based on this review, the usage of extrinsic energy holds a great potential to enhance the diffusion mechanism in SCI.

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Published

2018-10-15

How to Cite

Intan Fatihah Ahmad, Ghazali Omar, & Mohd Azli Salim. (2018). Extrinsic Activation Energy for Enhanced Solid-State Metallic Diffusion for Electrical Conductive Ink. Journal of Advanced Research in Fluid Mechanics and Thermal Sciences, 50(1), 32–39. Retrieved from https://semarakilmu.com.my/journals/index.php/fluid_mechanics_thermal_sciences/article/view/2855

Issue

Vol. 50 No. 1: October (2018)

Section

Articles

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