Parametric Study and Multi-Objective Optimization of Vapor Compression Heat Pump System by Using Environmental Friendly Refrigerant

Nyayu Aisyah; M Idrus Alhamid; Nasruddin; Sholahuddin; Arnas Lubis; Kiyoshi Saito

Authors

Nyayu Aisyah Department of Mechanical Engineering, Faculty of Engineering, Universitas Indonesia, Depok, Indonesia
M Idrus Alhamid Department of Mechanical Engineering, Faculty of Engineering, Universitas Indonesia, Depok, Indonesia
Nasruddin Department of Mechanical Engineering, Faculty of Engineering, Universitas Indonesia, Depok, Indonesia
Sholahuddin Faculty of Science andEngineering, Waseda University, Shinjuku-ku, Tokyo 169-8555, Japan
Arnas Lubis Faculty of Science andEngineering, Waseda University, Shinjuku-ku, Tokyo 169-8555, Japan
Kiyoshi Saito Faculty of Science andEngineering, Waseda University, Shinjuku-ku, Tokyo 169-8555, Japan

Keywords:

Environmental Friendly Refrigerant, Heat Pump , Multi-objective Optimization , Parameter Study

Abstract

This studyproposes the parameter study and multi-objective optimization of a vapor compression heat pump system using environmentallyfriendly refrigerant, R1224yd(Z). The effect of three design parametersincluding refrigerant mass flow rate, evaporation temperature,and condensation temperature on compressor work, cooling load in the evaporator, heat rejected by the condenser, and exergy of the system are investigated through parameter studies. Amulti-objective optimization was then performed. Exergy efficiency and exergoenvironmental value are the objectives of this optimization scenario. The purpose of the optimization is to obtain the optimum value of three design parametersin terms of exergyand environmental point of viewsso that the heat pump system has maximum exergy efficiency and minimum effect to the environment. The result showed that the systemwill be in the optimum condition at Te = 287.98 K, Tc= 315.56 K and refrigerant mass flow rate = 0.0321 kg/s with the exergy efficiency of 38.48% and exergoenvironmental value of 200.98 mPts/h.