Numerical Study on Heat Propagation in Laptop Cooling System

Authors

  • Wong Mian Sheng Faculty of Mechanical and Manufacturing Engineering, Universiti Tun Hussein Onn Malaysia, Batu Pahat, 86400 Johor, Malaysia
  • Abdulhafid M Elfaghi Faculty of Mechanical and Manufacturing Engineering, Universiti Tun Hussein Onn Malaysia, Batu Pahat, 86400 Johor, Malaysia
  • Lukmon Owolabi Afolabi Faculty of Mechanical and Manufacturing Engineering, Universiti Tun Hussein Onn Malaysia, Batu Pahat, 86400 Johor, Malaysia

DOI:

https://doi.org/10.37934/arfmts.99.1.5865

Keywords:

Heat propagation, laptop cooling, CFD, heat sink

Abstract

Thermal management of microelectronic devices has become increasingly important to maintain their performance and prolonging the lifespan of the devices. In this study, numerical simulation has been conducted to investigate the heat propagation for high performance microelectronic device of laptop. Two models are constructed and Ansys Fluent is used for the Computational Fluid Dynamics (CFD) simulation, source term is applied at the heat source, heat sink and two different material heat pipes are the main cooling components in the system. The results show that the improved design model is a better design for laptop cooling systems, and the increasing number of air vents, thermal conductivity, and length of heat pipes can effectively cool the high-powered microchip effectively. Transient simulation, considering the wick structure and working fluid in the simulation, is suggested for future work.

Author Biographies

Wong Mian Sheng, Faculty of Mechanical and Manufacturing Engineering, Universiti Tun Hussein Onn Malaysia, Batu Pahat, 86400 Johor, Malaysia

wongmiansheng@gmail.com

Abdulhafid M Elfaghi, Faculty of Mechanical and Manufacturing Engineering, Universiti Tun Hussein Onn Malaysia, Batu Pahat, 86400 Johor, Malaysia

abdulhafid@uthm.edu.my

Lukmon Owolabi Afolabi, Faculty of Mechanical and Manufacturing Engineering, Universiti Tun Hussein Onn Malaysia, Batu Pahat, 86400 Johor, Malaysia

afoolabs@gmail.com

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Published

2022-08-27

How to Cite

Wong Mian Sheng, Abdulhafid M Elfaghi, & Lukmon Owolabi Afolabi. (2022). Numerical Study on Heat Propagation in Laptop Cooling System. Journal of Advanced Research in Fluid Mechanics and Thermal Sciences, 99(1), 58–65. https://doi.org/10.37934/arfmts.99.1.5865

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Section

Articles