Multiphase Flow in Solder Paste Stencil Printing Process using CFD approach

Mohd Syakirin Rusdi; Mohd Zulkifly Abdullah; Mohd Sharizal Abdul Aziz; Muhammad Khalil Abdullah@Harun; Srivalli Chellvarajoo; Azmi Husin; Parimalam Rethinasamy; Sivakumar Veerasamy

Authors

Mohd Syakirin Rusdi School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 NibongTebal, Penang, Malaysia
Mohd Zulkifly Abdullah School of Aerospace Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 NibongTebal, Penang, Malaysia
Mohd Sharizal Abdul Aziz School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 NibongTebal, Penang, Malaysia
Muhammad Khalil Abdullah@Harun School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 NibongTebal, Penang, Malaysia
Srivalli Chellvarajoo School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 NibongTebal, Penang, Malaysia
Azmi Husin School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 NibongTebal, Penang, Malaysia
Parimalam Rethinasamy Celestica Malaysia Sdn. Bhd., Plot 15, Jalan Hi-Tech 2/3 Phase I, Kulim Hi-Tech Park, 09000 Kulim, Malaysia
Sivakumar Veerasamy Celestica Malaysia Sdn. Bhd., Plot 15, Jalan Hi-Tech 2/3 Phase I, Kulim Hi-Tech Park, 09000 Kulim, Malaysia

Keywords:

SAC387 , Stencil Printing , Lead-free Solder

Abstract

In this paper, Computational Fluid Dynamic (CFD) simulation approach is used to study the flowability of lead-free solder SAC387 in stencil printing process. The Volume of Fluid (VOF) method is used to simulate the multiphase flow between air and SAC387. The simulations are carried out at five different aperture area sizes. This paper focuses on the aperture filling of SAC387 where the result of the volume of SAC filling will be discussed. Results show that the volume error of the biggest aperture is 13.9% while the smallest aperture is 17.9%.