Effect of GNP/Ag Stretchable Conductive Ink on Electrical Conductivity

Authors

  • Mohd Azli Salim Fakulti Teknologi dan Kejuruteraan Mekanikal, Universiti Teknikal Malaysia Melaka, Melaka, Malaysia
  • Norida Mohammad Noor Jabatan Kejuruteraan Mekanikal, Politeknik Ungku Omar, Ipoh, Perak, Malaysia
  • Nor Azmmi Masripan Fakulti Teknologi dan Kejuruteraan Mekanikal, Universiti Teknikal Malaysia Melaka, Melaka, Malaysia
  • Adzni Md. Saad Fakulti Teknologi dan Kejuruteraan Mekanikal, Universiti Teknikal Malaysia Melaka, Melaka, Malaysia
  • Mohd Zaid Akop Fakulti Teknologi dan Kejuruteraan Mekanikal, Universiti Teknikal Malaysia Melaka, Melaka, Malaysia
  • Chew Kit Wayne School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore
  • Chonlatee Photong Faculty of Engineering, Mahasarakham University, Thailand
  • Feng Dai China Railway Eryuan Engineering Co., China

DOI:

https://doi.org/10.37934/aram.119.1.112

Keywords:

Stretchable conductive ink, graphene nanoplatelet, silver flakes, resistivity

Abstract

This research aims to develop and formulate a highly thermal graphene hybridization conductive ink combining graphene nanoparticles (GNP), silver flakes (Ag), and silver acetate (SA) as conductive fillers mixed with chemical and organic solvents. With improved properties, it overcomes the limitations of traditional materials while preserving their beneficial characteristics. The study evaluates how the resistivity and properties of the material change in response to environmental factors such as temperature and humidity and how these changes impact its performance in various applications. To develop a highly thermal graphene hybridization conductive ink, a new formulation of conductive ink was formulated using graphene nanoparticles (GNP), silver flakes (Ag), and silver acetate (SA) as conductive fillers mixed with organic solvents. In order to turn the batch of substances into a powder, they were sonicated and followed by stirring to form the mixture into a powder. Before curing at 250oC for 1 hour, the powder was dripped with organic solvents, 1-butanol, and terpineol and mixed using a thinky mixer machine to form a paste. Using a mesh stencil, the GNP hybrid paste was printed on copper substrates. With a scraper, the hybrid GNP paste was applied to the selected grid (3mm x 3mm) on three selected points of the substrate strip. In order to evaluate the performance, the resistivity of the hybrid GNP conductive ink at room temperature was set as the baseline and compared to the resistivity readings obtained at varying temperatures-humidity levels. GNP hybrid room temperature baseline and GNP hybrid after applying different temperature-humidity were compared in terms of electrical and mechanical properties. The average resistivity measurement at all points of the sample remained stable or decreased as the temperature increased. It demonstrates that the electrical conductivity of the ink degrades significantly as the temperature-humidity increases. This indicates that the ink is able to maintain its structural integrity and properties within certain temperature ranges. This signifies that a hybrid conductive ink has good thermal stability. Future work should investigate the strategies for improving the ink's performance under mechanical deformation, such as the use of additives or novel printing techniques.

Author Biographies

Mohd Azli Salim, Fakulti Teknologi dan Kejuruteraan Mekanikal, Universiti Teknikal Malaysia Melaka, Melaka, Malaysia

azli@utem.edu.my

Norida Mohammad Noor, Jabatan Kejuruteraan Mekanikal, Politeknik Ungku Omar, Ipoh, Perak, Malaysia

noridamn@puo.edu.my

Nor Azmmi Masripan, Fakulti Teknologi dan Kejuruteraan Mekanikal, Universiti Teknikal Malaysia Melaka, Melaka, Malaysia

azmmi@utem.edu.my

Adzni Md. Saad, Fakulti Teknologi dan Kejuruteraan Mekanikal, Universiti Teknikal Malaysia Melaka, Melaka, Malaysia

adzni@utem.edu.my

Mohd Zaid Akop, Fakulti Teknologi dan Kejuruteraan Mekanikal, Universiti Teknikal Malaysia Melaka, Melaka, Malaysia

zaid@utem.edu.my

Chew Kit Wayne, School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore

kitwayne.chew@ntu.edu.sg

Chonlatee Photong, Faculty of Engineering, Mahasarakham University, Thailand

Chonlatee.p@msu.ac.th

Feng Dai, China Railway Eryuan Engineering Co., China

fung_day@qq.com

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Published

2024-06-30

How to Cite

Mohd Azli Salim, Norida Mohammad Noor, Nor Azmmi Masripan, Adzni Md. Saad, Mohd Zaid Akop, Chew Kit Wayne, Chonlatee Photong, & Feng Dai. (2024). Effect of GNP/Ag Stretchable Conductive Ink on Electrical Conductivity. Journal of Advanced Research in Applied Mechanics, 119(1), 1–12. https://doi.org/10.37934/aram.119.1.112

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